Some Logic and CIS processes require high aspect ratio etch at a high productivity. The Titania series supports the temperature control and uniformity required for etch performance in terms of profile and defect densities needed for these applications.
Developed specifically for advanced applications in conductor and dielectric etch, the Dione series leverages the detailed engineering expertise of our development teams. As NAND and Logic etch geometries grow increasingly challenging, the Dione series supports ultra-low temperature requirements at high heat loads that change dynamically during the etch process.
As the semiconductor industry moves beyond 3nm Logic and 200+ layer NAND, there is a need to manage extremely high dynamic heat loads during the etch process. The Proteus series is designed to reach sub -70℃ temperatures specifically to address this emerging challenge. This product family is ahead of its time and is currently in co-development partnership with key customers.
Probe-testing of fully processed die on wafer requires specific temperatures range, uniformity and ramp-rate requirements at a high throughput. The CP series of small chillers is designed to meet the needs of the test-probe industry. Typical temp range is around 25C. With increasing chip densities and die count per wafer, there is an even greater push to improve these key features. Shinwa’s chiller family for this segment incorporates product features to address these exact needs. Our products are designed in to leading semiconductor test-probe equipment.