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During lithography, a complex set of circuit patterns drawn on a glass plate is exposed using UV light onto a silicon wafer coated with photoresist. As this occurs on a nano level, the precise temperature and humidity controls provided by T&H equipment create the optimum environment for accurate resist coating and pattern transfer.
During lithography, a complex set of circuit patterns drawn on a glass plate is exposed using UV light onto a silicon wafer coated with photoresist. As this occurs on a nano level, the precise temperature and humidity controls provided by PAC equipment create the optimum environment for accurate resist coating and pattern transfer.
During etching, a silicon wafer is exposed to gases that remove parts of the wafer that are not covered by layers of photoresist. Dry etch is an important and intricate step that is repeated multiple times in semiconductor manufacturing. Since such reactive ion etching can drastically raise the wafer temperature which could destroy layers of devices already existing on the wafer, state-of-the-art chillers are essential to remove excess heat efficiently.
Once a silicon wafer has been fully etched and finished with a repeating array of hundreds of die, each containing complex circuitry, it must be sliced to separate the die which are then packaged into IC chips. Cuts are made in the silicon using a diamond tool, producing heat; chillers are used here to provide stable temperature control during this finishing process.
After production, wafers containing semiconductor ICs are put through rigorous testing for performance and reliability using probe-test machines to ensure quality. Chillers attached to these testing machines, maintain the wafers at specific temperatures required by these test procedures.
Once a silicon wafer has been fully etched and finished with a repeating array of hundreds of die, each containing complex circuitry, it must be sliced to separate the die which are then packaged into IC chips. Cuts are made in the silicon using a diamond tool, producing heat; chillers are used here to provide stable temperature control during this finishing process.
During etching, a silicon wafer is exposed to gases that remove parts of the wafer that are not covered by layers of photoresist. Dry etch is an important and intricate step that is repeated multiple times in semiconductor manufacturing. Since such reactive ion etching can drastically raise the wafer temperature which could destroy layers of devices already existing on the wafer, state-of-the-art chillers are essential to remove excess heat efficiently.
After production, wafers containing semiconductor ICs are put through rigorous testing for performance and reliability using probe-test machines to ensure quality. Chillers attached to these testing machines, maintain the wafers at specific temperatures required by these test procedures.