The ESA series supports 300/200mm coater/developer which enables stable, high-quality processing and a smooth transition from R&D to volume production. It enables low footprint and with a higher throughput. Uptime has been improved by increasing the reliability of each component and simplifying maintenance.The ESA platform also supports DUV lithography and packaging.
The HE7 series supports all advanced lithography technologies for higher throughput, increased wafers per day, and improved overall equipment efficiency. Additionally, it meets industry requirements for supporting versatile lithography equipment capable of leading-edge processes, including double patterning.
The ME series supports the latest coater/developer equipped with high-technology with extendibility to advanced processes for high throughput, reduced footprint, improved availability and low CoO (Cost of Ownership) reduction. Its high reliability and productivity is recognized by worldwide customers, and continues to evolve to meet customer needs for leading-edge technologies.
450F series supports 300mm coater/developer for the 10nm technology node and beyond. It incorporates advanced features to support a wide range of applications from next generation development to high volume mass production. It helps improve coater/developer performance in three key areas - defectivity, productivity, and CoO (Cost of Ownership). It supports advanced immersion lithography, including double/multiple patterning as well as EUV process.