Process Ambient Control
Critical semiconductor processes such a lithography require precise control of the temperature and humidity as the wafer passes through the numerous stages of photoresist preparation before deep sub-micron circuits are printed on each die. Our THC equipment supply conditioned air that supports the industry’s leading lithography coater-developer tracks to maintain the integrity of the resist before exposure.
DESCRIPTION
Far far away, behind the word mountains, far from the countries Vokalia and Consonantia, there live the blind texts. Separated they live in Bookmarksgrove right at the coast.
When
January 2017
Who
Jason Davis, John Anderson, Mirco Cattabriga, Aaron Jones, Amanda Johnson, Steve McQueen
Far far away, behind the word mountains, far from the countries Vokalia and Consonantia, there live the blind texts. Separated they live in Bookmarksgrove right at the coast of the Semantics, a large language ocean. A small river named Duden flows by their place and supplies it with the necessary regelialia. It is a paradisematic country, in which roasted parts of sentences fly into your mouth.
‍
Far far away, behind the word mountains, far from the countries Vokalia and Consonantia, there live the blind texts. Separated they live in Bookmarksgrove right at the coast of the Semantics, a large language ocean. Far far away, behind the word mountains, far from the countries Vokalia and Consonantia, there live the blind texts. Separated they live in Bookmarksgrove right at the coast of the Semantics, a large language ocean. A small river named Duden flows by their place and supplies it with the necessary regelialia. It is a paradisematic country, in which roasted parts of sentences fly into your mouth.
‍
Far far away, behind the word mountains, far from the countries Vokalia and Consonantia, there live the blind texts. Separated they live in Bookmarksgrove right at the coast of the Semantics, a large language ocean.
Hidden ImageDetails ImageDetails Image
Grow your business.
Today is the day to build the business of your dreams. Share your mission with the world — and blow your customers away.
Start Now
Powered by Webflow
Process Ambient Control
Control and monitor your manufacturing environment with the utmost precision.
Our PAC products are equipped with cooling and heating functions and simultaneously allow precise control of temperature and humidity, and boast a precision of 0.1℃ between 20℃ and 27℃, and ±0.1％RH. Suitable for up to class 100 cleanrooms.

ESA Series

Preset airflow line

The ESA series supports 300/200mm coater/developer which enables stable, high-quality processing and a smooth transition from R&D to volume production. It enables low footprint and with a higher throughput. Uptime has been improved by increasing the reliability of each component and simplifying maintenance.The ESA platform also supports DUV lithography and packaging.

Air flow rate
7.4 m3/min
Footprint
0.62 m2
Occupied area
0.62 m2
Packaging
Preset airflow series

HE7 Series

High airflow line

The HE7 series supports all advanced lithography technologies for higher throughput, increased wafers per day, and improved overall equipment efficiency. Additionally, it meets industry requirements for supporting versatile lithography equipment capable of leading-edge processes, including double patterning.

Air flow rate
74.0 m3/min
Footprint
3.17 m2
Occupied area
0.62 m2
Packaging

ME Series

Adjustable airflow line

The ME series supports the latest coater/developer equipped with high-technology with extendibility to advanced processes for high throughput, reduced footprint, improved availability and low CoO (Cost of Ownership) reduction. Its high reliability and productivity is recognized by worldwide customers, and continues to evolve to meet customer needs for leading-edge technologies.

Air flow rate
18.0 - 33.7 m3/min
Footprint
0.82 m2
Occupied area
Value 3
Lithography
Adjustable airflow series

450F Series

Low power line

450F series supports 300mm coater/developer for the 10nm technology node and beyond. It incorporates advanced features to support a wide range of applications from next generation development to high volume mass production. It helps improve coater/developer performance in three key areas - defectivity, productivity, and CoO (Cost of Ownership). It supports advanced immersion lithography, including double/multiple patterning as well as EUV process.

Air flow rate
75.0 m3/min
Footprint
3.26 m2
Occupied area
Value 3
Lithography
450F